Xiaomi Mix Flip Spotted on IMEI Database, Design Renders Leak: All Details

Xiaomi Combine Flip is anticipated to launch alongside the Combine Fold 4, changing into the corporate’s first clamshell foldable smartphone. The Chinese language cellphone manufacturing firm lately launched the Mix Fold 3, however is but to formally announce a Flip mannequin. Now, the Xiaomi Combine Flip has reportedly been noticed on the IMEI database hinting at its imminent launch. Design renders of the purported Xiaomi clamshell foldable cellphone have been additionally beforehand leaked. The cellphone is anticipated to be a notable competitor to the lately launched Samsung Galaxy Z Flip 5.

An ITHome report spotted the Xiaomi Combine Flip on the IMEI database with the mannequin quantity 2311BPN23C. Within the screengrab shared on the Korean tech information web site, the Combine Flip moniker appears to have been confirmed, which was additionally tipped beforehand.

The Xiaomi Combine Flip is claimed to be very skinny and lightweight, in comparison with different modern clamshell fashions. Notably, the Combine Fold 3 is tipped to be slimmer than Samsung’s Galaxy Z Fold 5.

An earlier GSMChina report urged the potential design renders of the Xiaomi Combine Flip, that the publication claimed to have drawn up based mostly on sure manufacturing unit leaks. The purported handset is claimed to characteristic a triple rear digicam unit, with the third digicam providing 3x zooming capacities. A entrance digicam is seen with a centre-aligned hole-punch slot on the high of the first show.

Like most flagship telephones anticipated to launch in 2024, the Xiaomi Combine Flip is claimed to be powered by a yet-unannounced Qualcomm Snapdragon 8 Gen 3 SoC. It’s anticipated to be a robust competitor to the Galaxy Z Flip 5, which is powered by a Qualcomm Snapdragon 8 Gen 2 SoC and is provided with two 12-megapixel rear digicam sensors and a 10-megapixel entrance digicam sensor.